3D Printer Heated Bed Power Module High Current 210A MOSFET Upgrade RAMPS 1.4
Safe and reliable way to handle high current heate bed on 3D Printer
Easy to install and connect with supplied connection diagram
It will not overheat under normal load
Active cooling is not required but recommend
Item Type: 3D Printer Heated Bed Power Module
Based on powerful MOSFET HA210NO6.
Mounting holes: 3.2mm diameter, for M3 screws.
Distance between holes: 54x43mm.
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle.
Maximum current with active cooling: 210A.
Current: 50-80A safe for prolonged times without active cooling.
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this).
1 x Heated Bed Power Module.
1 x Connection cable for input signal.